Mastering the HDI PCB Manufacturing Process

Why Understanding the HDI PCB Manufacturing Process Matters？ As electronics become increasingly compact and powerful, High-Density Interconnect (HDI) PCBs have emerged as the backbone of advanced technology. Whether you are building next-gen smartphones, IoT devices, or aerospace applications, understanding the HDI PCB manufacturing process is critical to achieving both performance and reliability. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } PCBBUY, a leading global PCB manufacturer, is proud to offer cutting-edge HDI PCB solutions tailored to meet the most demanding requirements. In this guide, we outline the full spectrum of PCBBUY's HDI capabilities, step-by-step processes, and the engineering standards we maintain to ensure superior quality. 1. HDI PCB Material Selection Item Standard Remarks Material FR-4 TG135–TG170, halogen-free and CTI materials available upon request At PCBBUY, we use industry-proven materials like FR-4 for standard HDI builds, while also offering high-Tg, halogen-free options for high-performance applications. Customized dielectric materials are also available based on impedance or CTI needs. 2. HDI Layer Count and Stack-Up Options Item Standard Remarks Number of Layers 1st Order: 4-10 layers2nd Stage: 6-10 layers Custom stack-ups available From basic 1+N+1 to more advanced 2+N+2 constructions, PCBBUY supports multi-layer HDI PCB builds. Our engineers help you optimize layer configurations for signal integrity, cost, and thermal reliability. 3. Advanced Construction Types Item Standard Remarks Construction Type 1st order: 1+N+1, 1+1+N+1 +12nd order: 2+N+2, 1+2+N+2+1 Electroplated via filling available Our HDI stack-ups are engineered for high-density interconnects using buried and blind vias. For finer vias (≤0.3mm), we use electroplating filling processes to ensure signal continuity and mechanical reliability. 4. Trace Width Capabilities Item Standard Remarks Trace Width 2/2mil (min) Ideal for HDI/BGA and fine-pitch ICs PCBBUY leverages advanced imaging and etching technology to achieve minimum 2mil line/space designs. This enables complex routing for high-speed and RF circuits in HDI designs. 5. Blind Via Technology Item Standard Remarks Blind Via Mechanical ≥0.15mmLaser ≥0.075mm Specification review required Our blind via drilling capabilities include high-precision laser and mechanical processes. All via geometries are reviewed and validated before fabrication to ensure manufacturability and reliability. 6. Hole Size and Registration Item Standard Remarks Hole Size Min unilateral ≥3mil Custom drills possible on request With advanced CNC and laser drills, PCBBUY achieves micro-drilling tolerances ideal for stacked via and via-in-pad structures. 7. Hole Copper Thickness Item Standard Remarks Hole Copper >18μm (mechanical)>13μm (laser) Review required Ensuring sufficient copper thickness in vias is crucial for conductivity and reliability. PCBBUY uses tightly controlled plating parameters to ensure IPC standards are met. 8. Via Electroplating Process Item Standard Remarks Via Electroplating Depth: 0.05mm~0.1mmTolerance: ±15% Full via copper fill ensures metallization Using advanced electroplating systems, we fill microvias with copper to guarantee structural strength and thermal reliability. This is especially important for stacked or staggered vias in multi-order HDI designs. Why Choose PCBBUY for HDI PCB Manufacturing? Customized HDI Stack-Ups: We support all mainstream and specialized configurations. Precision Laser Drilling: For clean microvias down to 0.075mm. LDI & Fine-Line Imaging: Accurate 2/2mil trace widths. Advanced Plating Lines: Ensure copper fill, reliability, and consistent via quality. Global Delivery & Support: From prototyping to mass production. Conclusion Understanding the HDI PCB manufacturing process allows engineers and product managers to make smarter design and sourcing decisions. With PCBBUY's proven manufacturing expertise and a commitment to advanced technology, we’re here to bring your HDI designs to life with speed, precision, and reliability.

PCB Knowledge ⋅ 06/26/2025 17:10

Advanced HDI PCB Capabilities to High-Density Innovation

In today’s era of ultra-compact electronics and multi-functionality, the demand for advanced HDI PCB (High-Density Interconnect Printed Circuit Boards) is greater than ever. These multilayered boards are the backbone of smartphones, automotive radar systems, medical implants, and aerospace equipment. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } At PCBBUY, we specialize in high-precision advanced HDI PCB manufacturing, backed by rigorous engineering, leading-edge facilities, and full-stack capabilities to serve global innovators. What Is an Advanced HDI PCB? While standard HDI PCBs feature one or two layers of laser-drilled microvias, advanced HDI includes multi-order constructions such as 1+N+1, 2+N+2, 3+N+3, stacked or staggered vias, via-in-pad plating, and copper-filled microvias. These enable higher wiring density, better signal integrity, and reduced electromagnetic interference. PCBBUY’s Advanced HDI PCB Capabilities Overview Here’s a detailed breakdown of our production capabilities, based on our internal standards: Capability Specification Remarks Material FR-4 Custom options: TG135–TG170, halogen-free, CTI-enhanced materials Number of Layers 1st order: 4–10 layers2nd stage: 6–10 layers Supports progressive stack-up and multi-stage lamination Construction Types 1st order: 1+N+1, 1+1+N+1+12nd order: 2+N+2, 1+2+N+2+1 (n buried vias ≤0.3mm) Via structures are customized per client documentation; electroplated filled vias available Minimum Trace Width 2/2 mil (0.05/0.05mm) Designed for ultra-fine line routing using LDI imaging Blind Via Tolerance Mechanical ≥0.15mmLaser ≥0.075mm Microvias are stackable, compatible with copper via fill or resin fill techniques Hole Size Minimum: unilateral ≥0.3mm Mechanical drilling + laser micro-drilling compatible Hole Copper Thickness Mechanical: ≥18μmLaser: ≥13μm Optimized for conductivity and reliability in via structures Via Electroplating Depth: 0.05mm–0.1mmTolerance: ±15% Electroplated via filling ensures full-metal conductivity across all stacked via levels Manufacturing Process Flow at PCBBUY To achieve advanced HDI PCB quality, PCBBUY implements a tightly controlled and intelligent manufacturing process: Stack-up Simulation & DFM Review Our engineers simulate impedance, via positioning, and signal integrity before production begins. Laser Drilling Using CO₂ or UV laser machines, we drill microvias as small as 75μm with exacting depth control. LDI Imaging Laser Direct Imaging (LDI) allows precise fine-line exposure, supporting 2/2mil line/space designs. Copper Plating and Filled Vias Through electroplating, we fill blind vias with copper to ensure electrical continuity and thermal stability. Sequential Lamination Multi-order HDI requires multiple lamination steps—each conducted with vacuum pressure and x-ray alignment. AOI + Electrical Testing All PCBs are inspected with 100% AOI and Flying Probe or Fixture Testing to ensure functionality. Benefits of Choosing Advanced HDI PCBs from PCBBUY ✅ Compact size for wearables and handhelds ✅ Enhanced signal transmission speed ✅ Excellent thermal dissipation ✅ Support for BGA, CSP, and Flip-Chip mounting ✅ Multilayer routing in limited PCB real estate What Affects the Advanced HDI PCB Cost? At PCBBUY, we aim for high value and high yield. Here are major cost influencers: Cost Driver Impact on Price Layer count (e.g. 1+6+1) More laminations = higher processing complexity Microvia structure Stacked vias are costlier than staggered Via fill type Copper-filled > Resin-filled > Non-filled Base material TG170 or halogen-free increases material cost Line/space density 2/2mil requires LDI = increased processing cost Surface finish ENEPIG > ENIG > HASL Industries We Serve with Advanced HDI Consumer Electronics (e.g. smartphones, tablets) Automotive (radar, LiDAR, ADAS) 5G Infrastructure (antenna modules) Medical Devices (implantable monitors) Aerospace & Defense (satellite boards) Why Choose PCBBUY for Advanced HDI PCB Projects? Global fulfillment & multilingual engineering support Fast prototyping: 5–7 working days Free stack-up consultation & DFM support ISO9001, IATF 16949, UL certified 100% E-test, AOI, and QC records available FAQ: Advanced HDI PCB Insights 🔎 Question ✅ Answer What does 2+N+2 mean in HDI? It refers to two sequentially laminated outer layers and multiple inner layers (N) with microvias. Are stacked vias reliable? Yes, when copper-filled and plated correctly. PCBBUY follows IPC-6012 Class 2/3 standards. Can I use via-in-pad with advanced HDI? Yes, we support via-in-pad with laser drilling and copper fill. What’s the turnaround time for HDI prototypes? Typically 5–7 working days, depending on stack-up complexity. Ready to Build Your Next Advanced HDI PCB? Contact PCBBUY today to get a free engineering consultation, or try our instant quote tool online. Let our expertise empower your product innovation.

PCB Knowledge ⋅ 06/25/2025 15:03

Understanding HDI PCB Cost in Cost-Effective HDI Manufacturing

As the demand for miniaturized and high-performance electronics increases, HDI (High-Density Interconnect) PCBs have become essential across industries like mobile devices, automotive, medical, and aerospace. However, one of the most common questions engineers and procurement teams face is: PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } What exactly drives HDI PCB cost? In this article, PCBBUY explores the critical cost factors behind HDI PCB fabrication, including layer structure, materials, microvia processing, and copper plating—offering insights into how our advanced production capabilities help customers achieve high reliability at competitive prices. What Determines the Cost of an HDI PCB? 1. Layer Count & Stack-Up Strategy At PCBBUY, our HDI stack-up solutions range from: 1st Order HDI: 4–10 layers (1+N+1, 1+1+N+1+1) 2nd Order HDI: 6–10+ layers (2+N+2, 1+2+N+2+1) Higher layer counts and staggered or stacked via designs significantly increase lamination cycles, alignment complexity, and inspection requirements—directly affecting the cost. Pro Tip: Keeping to a 1st-order HDI layout can reduce up to 25% in production cost for mobile and wearable devices. 2. Construction Type: Via Structure Design PCBBUY supports both mechanical and laser via configurations: Construction Type Example Layout Via Size Support 1st Order HDI 1+N+1, 1+1+N+1+1 Buried vias ≤ 0.3mm 2nd Order HDI 2+N+2, 1+2+N+2+1 Stacked microvias ≤ 0.3mm Our engineers help customers choose between mechanical blind via and laser-drilled blind via based on electrical performance, density, and budget. 3. Minimum Trace & Spacing With a minimum line/space capability of 2/2mil, PCBBUY ensures compact designs without sacrificing signal integrity. However, the finer the lines, the more advanced the etching and imaging equipment required, increasing cost. Cost-saving tip: Slightly widening trace/space to 3/3mil can reduce HDI PCB cost by 10–15%. 4. Via & Hole Processing Blind Via Capabilities: Type Min Size Mechanical Blind Via ≥ 0.15mm Laser Blind Via ≥ 0.075mm Via Filling & Electroplating: Laser via plating depth: 0.05mm–0.1mm Tolerance: ±15% Copper-filling: Ensures via pad flatness for via-in-pad designs Advanced electroplating adds complexity but is essential for reliability and conductivity in HDI boards. 5. Material and Copper Specification Material Options: Base: FR-4 Optional: TG135–TG170, halogen-free, CTI-rated materials Hole Copper Thickness: No laser blind: >18μm Laser blind: >13μm Using high-Tg, low-loss materials and ensuring proper copper distribution affects signal quality and thermal performance—but also impacts material costs. 6. Summary Table: PCBBUY HDI PCB Core Capabilities Feature Capability Layer Count 4–10 layers (expandable) Trace Width 2mil minimum Blind Via Mech ≥ 0.15mm / Laser ≥ 0.075mm Hole Size Unilateral ≥ 3mil Hole Copper Mech >18μm / Laser >13μm Via Plating Depth 0.05–0.1mm (±15%) How PCBBUY Helps You Optimize HDI PCB Cost？ Early Design Reviews: We offer free DFM analysis to help reduce excessive stack-ups or avoid overuse of via-in-pad Transparent Pricing: Online quoting system provides instant visibility into price drivers In-House Laser & LDI Facilities: Shortens lead time and reduces outsourcing markup Flexible MOQ: We support small batches for prototypes without high NRE charges Typical HDI PCB Cost Range at PCBBUY Type Avg. Cost (USD/m²) Notes 1st Order HDI $80–$130/m² Smartphones, wearable devices 2nd Order HDI $150–$230/m² IoT, automotive, industrial Advanced Stack HDI $250+/m² Military, radar, base stations Note: Pricing varies based on material, via structure, and surface finish. Frequently Asked Questions (FAQ) ❓ Question ✅ Answer Why is HDI PCB more expensive than standard PCB? Due to advanced via processing (laser drill, plating), tighter tolerances, and multi-lamination. Can I reduce HDI cost by modifying layout? Yes. We recommend simplifying the via structure and optimizing line/space. Does copper filling for laser vias affect price? Yes, via-in-pad with filling and capping adds 10–15% to the total cost. Does PCBBUY offer HDI prototyping services? Absolutely! We support HDI prototype and small-batch production with low MOQ. Contact PCBBUY for Custom HDI PCB Cost Solutions Whether you're a startup prototyping wearables or an OEM sourcing complex HDI boards, PCBBUY is ready to support your HDI journey. With cutting-edge manufacturing lines and expert engineering support, we help you balance performance and cost effectively.

PCB Knowledge ⋅ 06/24/2025 16:43

HDI PCB Layout Capabilities and Manufacturing Expertise

As the demand for high-performance and miniaturized electronics continues to rise, High Density Interconnect (HDI) PCB layout has become the go-to solution for advanced electronic applications. At PCBBUY, we specialize in delivering high-quality HDI PCB layout and fabrication services that meet the exacting demands of global clients. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } What is HDI PCB Layout? HDI (High Density Interconnect) PCB layout refers to the strategic design of PCBs with higher wiring densities per unit area. This is achieved by utilizing finer lines and spaces, smaller vias, and higher connection pad density, which allows for more functionality in a smaller footprint. At PCBBUY, our HDI PCB layouts are optimized for signal integrity, electrical performance, and space efficiency, making them ideal for smartphones, tablets, wearable devices, medical electronics, and automotive systems. HDI PCB Layout Design & Construction Types One of the cornerstones of HDI PCB layout is the stack-up and via structure. PCBBUY supports both first-order and second-order HDI constructions: 1st Order HDI: 1+N+1, 1+1+N+1+1 (n buried vias ≤ 0.3mm) 2nd Order HDI: 2+N+2, 1+2+N+2+1 (n buried vias ≤ 0.3mm) These configurations allow us to offer enhanced electrical routing and reduced signal loss. Based on your design requirements, our engineering team will recommend the most suitable layout using mechanical via or via filling + electroplating technologies. Core Materials Used in HDI PCB Layout PCBBUY utilizes top-grade materials to ensure excellent reliability and thermal performance: Base Material: FR-4 Optional Materials: TG135-TG170, halogen-free materials, CTI rated laminates (customizable) Material selection is flexible depending on the project requirements and end-use application, with an emphasis on high thermal stability and flame retardance. HDI PCB Layering Capabilities We support a wide range of layer configurations to meet the needs of various industries: Standard HDI Layers: 4–10 layers (1st Order) Advanced HDI Layers: 6–16 layers (2nd Order) For more complex layouts, our pcb production lines are capable of fabricating high-density multilayer PCBs with precision. Manufacturing Precision for HDI Layouts PCBBUY delivers highly accurate PCB manufacturing parameters to ensure high signal integrity and minimal interference: Parameter Capability Notes Trace Width 2/2 mil (minimum) Ideal for fine-pitch BGA layout Blind Via ≥0.15mm (mechanical), ≥0.075mm (laser) Suitable for microvia interconnects Hole Size Minimum 0.3mm unilateral High precision CNC drilling Hole Copper Thickness >18um (mechanical), >13um (laser blind burial) Fully filled and reliable Via Electroplating Depth 0.05–0.1mm, Tolerance: ±15% Ensures complete metal coverage inside vias Advanced Via Technology in HDI Layout HDI layout often requires a combination of blind vias, buried vias, and microvias. PCBBUY provides both mechanical drilling and laser drilling options depending on the PCB structure. Laser vias are commonly used in HDI stack-ups due to their accuracy and ability to fit within ultra-fine pitch devices. Our via electroplating process fills the via with copper, ensuring strong conductivity and long-term durability. We also offer stacked and staggered via structures, ideal for 2+N+2 or 3+N+3 layouts. Why Choose PCBBUY for HDI PCB Layout & Fabrication? Engineering Expertise: Decades of experience in HDI layout and production. End-to-End Service: From stack-up planning to layout optimization to mass production. Customization: Flexible construction types, material options, and layer count. International Quality: IPC Class 2/3 standards, RoHS compliant, UL and ISO certified. Responsive Service: 24-hour engineering support and rapid prototyping. HDI PCB Layout FAQ What is the difference between a standard PCB layout and an HDI PCB layout? Answer: HDI (High-Density Interconnect) PCBs use advanced technologies such as laser-drilled microvias, blind/buried vias, and ultra-fine trace/spacing to achieve higher component density, smaller board sizes, and better signal performance compared to standard PCB layouts. Key Comparison Chart: Feature Standard PCB HDI PCB Layout Via Types Through-hole Microvia, Blind/Buried Min. Trace/Spacing ≥ 4/4 mil ≥ 2/2 mil Board Density Medium High Application Consumer Electronics Mobile, Medical, Auto What is the typical layer stack-up for HDI PCB at PCBBUY? Answer: PCBBUY supports complex stack-up structures such as: 🔹 1+N+1 (Single-order HDI) 🔹 2+N+2, 3+N+3 (Multi-order HDI) 🔹 Via-in-pad, staggered vias, and copper-filled vias 📐 Example Stack-up: Top Layer (L1) │ Blind Via ▼ Core Layer (L2~Ln) │ Buried Via ▼ Bottom Layer (Ln+1) Based on your design, we recommend the optimal stack-up to ensure performance, reliability, and manufacturability. What are PCBBUY’s capabilities in trace width and spacing for HDI layout? Answer: ✅ Minimum Trace Width: 2 mil (0.05 mm) ✅ Minimum Spacing: 2 mil (0.05 mm) Tip: We recommend ≥ 4 mil to reduce cost and improve yield unless ultra-dense routing is required. Technology Used: Laser Direct Imaging (LDI) Automated Etch-Back AOI Inspection How are blind and buried vias implemented at PCBBUY? Answer: We use: Laser drilling for blind vias (≥0.075 mm) Mechanical drilling for buried vias (≥0.15 mm) Electroplated via filling for strength and conductivity ±15% tolerance control for consistent depth Via Process Options: Via Type Tech Used Min. Size Application Blind Laser Drill 0.075 mm L1 → L2 or Ln → Ln-1 Buried Mechanical Drill 0.15 mm L2 → L3 (internal layers) Microvia Laser Drill + Fill 0.1 mm HDI density builds Can PCBBUY support customized materials for HDI PCB layout? Answer: Absolutely. While FR-4 is the standard base material, we also offer: ✅ TG135–TG170 High-Tg ✅ Halogen-Free Laminates ✅ CTI Customized Substrates These are ideal for high-frequency, thermal, or environmental compliance requirements. What applications are HDI PCBs most suitable for? Answer: HDI PCBs are essential in industries requiring high performance and compact size, such as: Aerospace & Defense Smartphones & Wearables Automotive Radar & EV Systems High-Speed Computing & Servers Medical Imaging Devices How does PCBBUY ensure the quality of your HDI PCB layout? Answer: PCBBUY follows a rigorous QC process, including: Automated Optical Inspection (AOI) Laser depth profiling for vias Impedance Control Simulation X-ray via inspection IPC Class 2 & 3 Standards We are ISO 9001, RoHS, and UL certified to meet global quality requirements. Start Your HDI PCB Layout Project with PCBBUY PCBBUY is committed to providing innovative and reliable HDI PCB layout services to customers worldwide. Whether you are in the prototyping phase or need large-volume production, our technical team is ready to assist you from start to finish. Contact us today to upload your design files and receive a free HDI layout consultation.

PCB Knowledge ⋅ 06/23/2025 16:14

HDI PCB Stackup Capabilities for High-Density Applications

In the fast-evolving world of electronics, HDI (High-Density Interconnect) PCBs have become a critical component for compact, high-performance devices. At PCBBUY, a leading HDI PCB stackup manufacturer in China, we deliver engineered stackup solutions that ensure signal integrity, miniaturization, and robust mechanical reliability. This article explores our HDI PCB stackup capabilities based on industry standards and our proprietary manufacturing process. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } 1. What Is HDI PCB Stackup and Why It Matters An HDI PCB stackup refers to the layer configuration and interconnection structure in a high-density circuit board. Proper stackup design is crucial for high-speed signal performance, thermal management, and compact layout. At PCBBUY, we provide 1st-order stackups (1+N+1) and complex multi-order stackups (2+N+2, 3+N+3, etc.), accommodating the most demanding HDI designs across multiple industries, including mobile, automotive, and medical devices. 2. PCBBUY's HDI PCB Stackup Capabilities Item Specification Material FR-4 base, TG135-TG170, halogen-free and CTI-customizable materials Number of Layers 1st order: 4-10 layers; 2nd stage: 6-10 layers Construction Types 1+N+1, 1+1+N+1+1; 2+N+2, 1+2+N+2+1 (n buried vias ≤ 0.3mm) Trace Width Minimum 2/2mil (50µm/50µm) Blind Vias Mechanical: ≥0.15mm; Laser: ≥0.075mm Hole Size Minimum unilateral ≥3mil (75µm) Hole Copper ≥18µm for no laser burial; ≥13µm for laser buried vias Via Electroplating 0.05mm–0.1mm depth with ±15% tolerance Our stackup engineering focuses on signal layer placement, via optimization, and copper balancing to enhance EMC, impedance control, and manufacturability. 3. Advanced Construction Types for Complex HDI PCB Stackups PCBBUY supports single, double, and multiple HDI stackup configurations. Popular examples include: 1+N+1: A single build-up layer on both sides of the core. 2+N+2: Two build-up layers for higher routing density. Any-layer HDI: Fully interconnected layers using laser vias for ultra-high-density devices. We prioritize internal mechanical via structures based on customers' laminated stackup drawings. When needed, we implement via filling and copper plating processes for enhanced structural stability. 4. Key Processes Behind Our HDI Stackup Manufacturing Laser Drilling: Precision laser drilling enables blind vias as small as 0.075mm. Sequential Lamination: Multistage lamination for multi-order stackups. Via Filling & Electroplating: Copper is filled into via holes to ensure full metalization. Impedance Control: Adjusted dielectric thickness and trace geometry to maintain tight signal performance. All stackups undergo thorough design review, including thermal expansion simulation and manufacturability assessments. 5. Customized Materials and Quality Control We offer flexible options including: Base Materials: FR-4, TG135-TG170, halogen-free, or CTI-rated options Custom Trace Widths: Starting from 2mil for high-density routing Electroplating Tolerance: Maintained within ±15% to ensure reliable conductivity Our in-house engineering team works closely with clients to evaluate via reliability, copper thickness uniformity, and stackup impedance. 6. Why PCBBUY for Your HDI PCB Stackup Needs Strong R&D support for multi-order stackups Competitive lead times and scalable volume production Engineering assistance with stackup review and optimization Fully customized stackup proposals based on your Gerber or stackup design 7. FAQ: 5 Common Questions About HDI PCB Stackup Q1: What is the best stackup type for signal integrity in HDI PCBs? A: A symmetrical stackup with controlled impedance layers is preferred, such as 1+N+1 or 2+N+2, depending on signal speed and density. Q2: Can I customize the dielectric material in the stackup? A: Yes, PCBBUY offers FR-4, high-Tg, halogen-free, and CTI-custom materials to meet electrical and environmental demands. Q3: What’s the minimum via size PCBBUY can support? A: For laser vias, the minimum hole size is 0.075mm; for mechanical blind vias, it’s 0.15mm. Q4: How do you ensure copper consistency in via filling? A: We use laser via electroplating with copper fill, ensuring complete metalization and depth tolerance within ±15%. Q5: Does PCBBUY support stackup design assistance? A: Absolutely. Our engineering team offers DFM reviews, stackup simulations, and structure recommendations based on your application.

PCB Knowledge ⋅ 06/19/2025 14:34

HDI Multilayer PCB Manufacturing Capabilities Solutions

As the demand for high-density interconnect (HDI) multilayer PCBs continues to surge across industries like automotive electronics, telecommunications, and IoT devices, choosing a reliable manufacturer with proven capabilities becomes crucial. At PCBBUY, we specialize in delivering HDI multilayer PCB solutions that meet stringent design and performance requirements. In this article, we provide an in-depth look at our HDI manufacturing capabilities based on our internal process standards and how they translate to high-quality PCB production. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Materials for HDI Multilayer PCB TG135–TG170 FR-4 and Halogen-Free Options At PCBBUY, we use FR-4 as the standard material for HDI multilayer PCB fabrication, with support for TG135 to TG170 range to meet different thermal and mechanical performance needs. Additionally, halogen-free and CTI-rated materials can be customized based on customer specifications for higher safety and environmental standards. Layer Count Flexibility in HDI Multilayer PCB Stackups From 4-Layer to 10-Layer and Beyond Our manufacturing supports: 1st Order HDI: 4 to 10 layers 2nd Stage HDI: 6 to 10 layers This flexibility allows PCBBUY to deliver complex HDI multilayer PCB stack-ups that are suitable for both consumer-grade and industrial-grade electronics. Construction Types for HDI Multilayer PCB Sequential Lamination with Buried and Blind Vias We support a wide variety of HDI constructions, including: 1st order: 1+N+1, 1+1+N+1+1 (with buried vias ≤ 0.3 mm) 2nd order: 2+N+2, 1+2+N+2+1 We typically prefer internal mechanical vias for enhanced structural integrity, but where design limits apply, we offer electroplating via filling processes as an alternative. HDI Multilayer PCB High Precision Trace Width and Spacing Minimum 2/2 mil for Fine-Line Capability Our HDI multilayer PCB lines are manufactured with minimum 2/2 mil trace width/spacing, enabling ultra-compact routing ideal for mobile devices, wearables, and HDI applications. HDI Multilayer PCB Advanced Blind Via Capabilities Laser and Mechanical Blind Via Support We offer both: Mechanical blind holes: ≥ 0.15 mm Laser blind holes: ≥ 0.075 mm These capabilities allow for more flexible routing between layers, reducing layer count and saving PCB real estate. HDI Multilayer PCB Minimum Drilled Hole Size Unilateral Hole Size ≥ 3 mil To support high-density BGA components and fine-pitch designs, PCBBUY guarantees drill accuracy with minimum unilateral hole size of 3 mil, enabling us to manufacture intricate via structures with reliable plating quality. HDI Multilayer PCB Hole Copper Thickness Standards Ensuring Structural and Electrical Reliability Our plating specifications for via copper include: Mechanical hole (no laser): copper thickness > 18 μm Laser blind holes: copper thickness > 13 μm This ensures sufficient current-carrying capacity and long-term reliability in multilayer boards. HDI Multilayer PCB Via Electroplating Capabilities Electroplated Copper Filled Vias for HDI Multilayer PCBs For filled via applications: Electroplating depth: 0.05 mm – 0.1 mm Depth tolerance: ±15% We use high-precision electroplating techniques to ensure the surface of the hole is fully metalized, providing robust interlayer connections and minimizing signal distortion. HDI Multilayer PCB Manufacturing Process Optimization at PCBBUY Process Review and Customization Available All specifications in our HDI multilayer PCB workflow can be reviewed and tailored: Customized material stack-ups Application-specific blind/buried via combinations Electroplating strategies based on current load and thermal demands Our engineers collaborate closely with clients during the DFM (Design for Manufacturability) phase to optimize performance, cost, and production yield. Why Choose PCBBUY for Your HDI Multilayer PCB Projects? With decades of PCB manufacturing experience and strict adherence to IPC standards, PCBBUY offers one-stop HDI multilayer PCB fabrication with a focus on quality, reliability, and flexibility. Whether you're prototyping or scaling to mass production, our advanced capability matrix ensures that your complex design can be manufactured with confidence. HDI Multilayer PCBs AQ To help you better understand the unique characteristics and advantages of HDI multilayer PCBs, here are answers to some of the most frequently asked questions. What Is the Difference Between HDI Multilayer PCBs and Standard PCBs? HDI multilayer PCBs (High-Density Interconnect) are distinguished from traditional PCBs by their higher interconnection density, finer lines/spaces, smaller vias, and thinner materials. Here's a comparison: Feature Standard Multilayer PCB HDI Multilayer PCB Trace Width/Spacing ≥ 4/4 mil ≥ 2/2 mil Via Type Through-hole Blind/Buried/Laser via Layer Interconnect Basic stack-ups Advanced sequential lamination (1+N+1, 2+N+2) Component Density Low to moderate Very high Signal Integrity Standard Optimized for high-speed signals Cost Lower Higher due to complexity HDI multilayer boards are especially valuable in space-constrained, signal-sensitive, and high-performance electronic designs—such as smartphones, automotive control units, and aerospace equipment. Why Are HDI Multilayer PCBs More Expensive? The cost of manufacturing HDI multilayer PCBs is higher for several key reasons: Advanced Fabrication Equipment: Laser drilling, via filling, and sequential lamination require specialized, high-precision machinery. Increased Process Steps: HDI PCBs may involve multiple lamination cycles and more intricate quality checks. Material Requirements: High TG materials, halogen-free options, or low Dk/Df substrates add to raw material costs. Yield Challenges: Due to the tight tolerances, more stringent process controls are needed to ensure acceptable yields. While the cost is higher than conventional PCBs, the performance gains and miniaturization benefits often justify the investment in HDI technology. What Testing and Certifications Are Offered? To guarantee the reliability and performance of HDI multilayer PCBs, PCBBUY provides multiple in-house and third-party testing options: Testing Method Description Flying Probe Test Non-contact, electrical continuity and isolation test for prototypes or small batches X-ray Inspection Used to verify BGA soldering, internal via structures, and detect hidden defects Impedance Control Measurement Ensures critical signals meet high-speed requirements Microsection Analysis Cross-sectional inspection of vias and multilayer structures Solderability Test Verifies PCB surface finishes can be reliably soldered AOI (Automated Optical Inspection) High-speed visual inspection for surface defects We also comply with IPC Class 2 or Class 3 standards, RoHS, and REACH directives to support international markets. What Is the Fastest Prototype Turnaround for HDI Multilayer PCBs? At PCBBUY, we understand the importance of speed in product development. Our expedited services can deliver: HDI Multilayer PCB prototypes in as fast as 5 working days Standard lead time for complex HDI stack-ups: 7–10 working days Mass production orders: Depending on layer count and complexity, typically 10–15 working days Contact our service team to request expedited processing or for support on urgent projects. Conclusion PCBBUY’s HDI multilayer PCB manufacturing capabilities combine precision, customization, and advanced process controls. From material selection to blind via plating, every step is optimized for high-performance applications. Trust PCBBUY to deliver your next generation of HDI PCBs with industry-leading consistency and service. From understanding why HDI multilayer PCBs differ from traditional PCBs, to learning about testing options and turnaround times, it's clear that PCBBUY is equipped to handle complex HDI requirements with both speed and precision. Whether you’re working on high-speed data transmission, RF designs, or ultra-compact modules, our expert engineering team is ready to bring your vision to life.

PCB Knowledge ⋅ 06/18/2025 15:00

HDI PCB in China Deep Dive into Capabilities

Introduction High-Density Interconnect (HDI) PCBs are becoming the backbone of modern electronic design, offering superior electrical performance, increased functionality, and reduced weight and size. When global engineers search for "HDI PCB China," they're not just looking for affordability—they're looking for scalable precision manufacturing. This article explores PCBBUY's advanced HDI PCB production capabilities and how our factory stands out in the highly competitive Chinese PCB market. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } HDI PCB China Materials Customized Options At PCBBUY, we source high-grade FR-4 base materials to ensure structural integrity and dielectric consistency. We offer a full range of material customizations including: TG135-TG170 options for thermal reliability Halogen-free materials for environmentally safe applications CTI-rated substrates for high-voltage endurance All materials are RoHS compliant, and special materials can be reviewed and customized according to your project specifications. Flexible HDI PCB Stacking When it comes to HDI PCB stack-up, PCBBUY supports: 1st-order HDI: 4–10 layers 2nd-stage HDI: 6–10 layers with sequential lamination Multilayer configurations are tailored for signal integrity and impedance control, making them ideal for mobile devices, wearable electronics, and high-frequency systems. Construction Types Optimized Structures for Compact Design Our engineering team provides precision construction types such as: 1st-order HDI examples: 1+N+1, 1+1+N+1+1 2nd-order HDI examples: 2+N+2, 1+2+N+2+1 All vias ≤ 0.3mm are supported. Depending on your stack-up and routing requirements, we use either internal mechanical vias or filled electroplated microvias. Trace Width and Spacing Minimum trace width/spacing: 2/2 mil (0.05/0.05mm) This allows us to support high-speed and high-density applications without compromising signal integrity. Our photolithography process ensures edge definition with tight tolerance. Blind Via Technology PCBBUY offers both mechanical and laser drilling for blind vias: Mechanical blind vias: ≥ 0.15mm diameter Laser blind vias: ≥ 0.075mm diameter Each type is reviewed per customer spec. Laser vias allow for higher density interconnection while mechanical vias offer robustness for inner-layer connectivity. Hole Size Minimum unilateral hole size: ≥3 mil (0.076mm) Our laser and mechanical drills are calibrated regularly to ensure precision. We also support via-in-pad designs for BGA packages, helping to reduce component footprint. Hole Copper Thickness No laser blind burial: Mechanical hole copper >18μm Laser blind burial: Mechanical hole copper >13μm All plating thicknesses are verified using cross-section and X-ray analysis. Customized plating is available depending on current-carrying or thermal dissipation requirements. Via Electroplating Via Electroplating Depth: 0.05mm to 0.1mm Tolerance: ±15% PCBBUY uses advanced copper electroplating techniques to ensure the entire hole wall is fully metalized. Our process fills the via from bottom to top to avoid voids and ensure maximum reliability under thermal cycling. Why Choose PCBBUY for HDI PCB China Manufacturing With years of experience and advanced HDI production lines, PCBBUY provides: Quick turnaround prototyping to volume production Dedicated engineering review for DFM and DFA Full-stack customization: stack-up, copper weight, via type, surface finish International shipping and multilingual customer service We support end-markets from automotive and medical to aerospace and IoT. When searching for a reliable "HDI PCB China" partner, choose PCBBUY for proven capability and global trust. Ready to Start Your Project? Contact us now for a free design review or instant quotation. Upload your Gerber files or chat with one of our technical consultants. Let PCBBUY take your next-generation HDI PCB from design to delivery with precision and care.

PCB Knowledge ⋅ 06/16/2025 16:05

Advanced Capabilities of a Leading HDI PCB Manufacturer

As the electronics industry demands increasingly compact, high-performance, and multi-layered designs, choosing a reliable HDI PCB manufacturer becomes critical. At PCBBUY, we specialize in manufacturing high-density interconnect (HDI) printed circuit boards using advanced techniques and stringent quality standards. Our capabilities ensure optimal performance in complex electronic applications, from mobile devices to aerospace systems. In this article, we detail our comprehensive HDI PCB manufacturing capabilities, focusing on process specifications and material expertise that set us apart as a premier HDI PCB partner. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } 1. Material Engineering Excellence – Foundation of a Reliable HDI PCB Manufacturer As an established HDI PCB manufacturer, PCBBUY selects high-grade base materials to meet diverse thermal and electrical demands. Our standard material is FR-4, with customization available including: TG135-TG170 range laminates Halogen-free options CTI-compliant materials This material flexibility enables us to support a wide variety of industrial applications, from automotive ECUs to 5G modules, where temperature resilience and dielectric stability are essential. 2. Multilayer Design from a True HDI PCB Manufacturer Our multilayer HDI PCBs are fabricated with industry-leading precision. We support two core production stages: 1st Order HDI: 4–10 layers 2nd Stage HDI: 6–10 layers and above Whether for compact handheld devices or high-layer-count server boards, PCBBUY ensures each layer is aligned with micrometer-level accuracy. Customization is also available for even more complex stackups. 3. Construction Types of HDI PCB Manufacturer We accommodate both 1st and 2nd order HDI constructions with buried via support: 1st Order Examples: 1+N+1, 1+1+N+1+1 (with buried vias ≤0.3mm) 2nd Order Examples: 2+N+2, 1+2+N+2+1 (with buried vias ≤0.3mm) Our internal mechanical via structures are recommended for high reliability, though we also support electroplated via filling when internal routing constraints apply. This flexibility positions PCBBUY as a responsive and capable HDI PCB manufacturer ready for custom engineering challenges. 4. Ultra-Fine Trace Width of HDI PCB Manufacturer At PCBBUY, we meet the most demanding design rules with: Minimum trace width: 2 mil (0.05mm) This level of precision is made possible through advanced photolithography and etching control, enabling signal integrity even in the most densely packed HDI layouts. 5. Advanced Blind Via Processing at a Top HDI PCB Manufacturer Blind vias are essential in HDI structures, allowing interconnection between outer and inner layers without impacting other layers. PCBBUY offers: We utilize CO₂ and UV laser drilling for high precision, supported by strict depth control and alignment systems. Every blind via is inspected using X-ray metrology to ensure layer-to-layer consistency. Via Type Minimum Hole Size Mechanical Blind Via ≥0.15mm Laser Blind Via ≥0.075mm We utilize CO₂ and UV laser drilling for high precision, supported by strict depth control and alignment systems. Every blind via is inspected using X-ray metrology to ensure layer-to-layer consistency. 6. Micro Hole Drilling and Copper Plating of HDI PCB Manufacturers Our minimum unilateral hole size is ≥0.3mm, supporting a wide range of via types including microvia and via-in-pad applications. To ensure conductivity and structural reliability, PCBBUY uses: >18μm copper thickness for mechanical holes (non-laser blind burial) >13μm copper thickness for laser blind holes These parameters exceed IPC Class 3 reliability standards, especially critical for mission-critical and medical applications. 7. Copper-Filled Via Electroplating of HDI PCB Manufacturer PCBBUY employs a laser via electroplating process that includes: Plating Depth Range: 0.05mm – 0.1mm Tolerance: ±15% This process ensures full metallization of the via barrel. Copper is filled into the hole using controlled current density and bath chemistry, enabling via-in-pad flatness, ideal for BGA components and high-frequency signals. Frequently Asked Questions (FAQ) Q: What is the minimum trace width PCBBUY supports? A: We support trace widths as small as 2 mil (0.05mm), ideal for compact and high-speed designs. Q: Can PCBBUY handle via-in-pad designs for BGAs? A: Yes, our copper-filled via electroplating ensures flat, reliable surfaces for via-in-pad BGA applications. Q: What HDI constructions do you support? A: We support 1st order (1+N+1) and 2nd order (2+N+2) HDI stackups with optional buried vias. Q: What laser via sizes can be manufactured? A: We can produce laser blind vias as small as 0.075mm in diameter. Conclusion: Choose PCBBUY – The Trusted HDI PCB Manufacturer At PCBBUY, our HDI PCB manufacturing capabilities are rooted in cutting-edge engineering, rigorous process control, and deep material knowledge. Our experienced team, state-of-the-art equipment, and customer-centric customization options make us the ideal partner for advanced HDI projects. Whether you're developing wearable technology, IoT modules, or avionics systems, PCBBUY is your go-to HDI PCB manufacturer committed to delivering precision, performance, and peace of mind.

PCB Knowledge ⋅ 06/13/2025 17:44

HDI PCB Fabrication Capabilities: Advanced Technology

As high-performance, miniaturized electronics dominate the market, HDI PCB fabrication (High-Density Interconnect Printed Circuit Board fabrication) is at the forefront of advanced electronic design. At PCBBUY, we offer industry-leading HDI PCB manufacturing services—from prototype to mass production—backed by precision equipment, expert engineering, and a commitment to quality. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } This article introduces our full range of HDI PCB fabrication capabilities, including technical standards, process highlights, and material options. Whether you’re developing wearable technology, communication modules, or automotive sensors, PCBBUY’s HDI production line delivers reliability, precision, and scalability. 1. HDI PCB Fabrication Materials and Layering Options ● Material Options Our default HDI PCB material is high-quality FR-4, with customizable thermal and environmental performance. We support TG135–TG170 and halogen-free materials as well as CTI-rated ItemStandardRemarksMaterialFR-4TG135–TG170, halogen-free / CTI materials can be customized ● Layer Capabilities 1st-order HDI: 4–10 layers 2nd-order HDI: 6–10 layers Layer stack-up customization is available based on application needs. 2. Construction Types for HDI PCB Fabrication We support a wide variety of sequential lamination structures including: 1st order: 1+N+1, 1+1+N+1+1 2nd order: 2+N+2, 1+2+N+2+1 These support buried vias ≤ 0.3 mm, with mechanical or laser drilled microvias. Based on your Gerber stack-up or design file, our team will choose the most efficient method—mechanical drill or electroplating via filling process. 3. Precision Trace Width in HDI PCB Fabrication PCBBUY maintains minimum trace width/spacing of 2/2 mil, ideal for high-density, high-frequency boards used in RF or digital signal processing. This fine resolution is supported by advanced dry-film imaging and AOI (Automated Optical Inspection) systems to ensure signal integrity and impedance control. 4. Advanced Blind Via and Microvia Technology We support both mechanical and laser-drilled blind vias: Mechanical blind via: ≥0.15 mm Laser blind via: ≥0.075 mm This provides flexibility based on cost and performance requirements. For multi-stack structures, we offer stacked or staggered via architectures. 5. HDI PCB Fabrication Drill Hole Size and Copper Requirements Our standard via hole size tolerance and hole copper plating ensure robustness during assembly and repeated thermal cycles. Item Standard Remarks Hole Size Minimum unilateral ≥ 3 mil May be adjusted Hole Copper >18 µm (no laser via), >13 µm (laser via) Verified via cross-section inspection 6. Via Filling and Electroplating Control in HDI PCB Fabrication PCBBUY uses advanced laser via electroplating technology to ensure 100% metallization: Filling depth: 0.05–0.1 mm Tolerance: ±15% The hole is filled with copper to ensure smooth pad formation and excellent BGA solderability. 7. End-to-End HDI PCB Fabrication Workflow at PCBBUY ● Design Verification & CAM Optimization We verify all customer stack-up and drill data, optimizing for impedance, thermals, and manufacturability. ● Laser Microvia Drilling & X-ray Positioning High-accuracy UV laser systems drill sub-100µm vias with automated X-ray alignment for perfect layer registration. ● Sequential Lamination Multilayer builds such as 2+N+2 use high-Tg resin systems and low CTE (Coefficient of Thermal Expansion) to maintain dimensional stability. ● Via Filling & Electroplating Full-fill plating of blind vias ensures no air gaps, eliminating potential failure points during BGA soldering or reflow. ● Surface Finishes We offer ENIG, immersion silver, OSP, and ENEPIG compatible with HDI stack-ups. Conclusion: Why Choose PCBBUY for HDI PCB Fabrication At PCBBUY, we combine engineering expertise with scalable infrastructure to meet all levels of HDI PCB fabrication—from quick-turn prototypes to volume production. Our deep capabilities in microvia control, fine line etching, laser drilling, and via plating allow us to serve high-end industries like medical, aerospace, and telecommunications. If you’re looking for a professional HDI PCB manufacturer with custom stack-up solutions, tight tolerance control, and fast lead times, PCBBUY is your trusted partner.

PCB Knowledge ⋅ 06/11/2025 15:49

HDI PCB Design Guide: Advanced Manufacturing Capabilities

In the ever-evolving world of electronics, High-Density Interconnect (HDI) PCBs play a pivotal role in driving miniaturization, performance, and integration. At PCBBUY, our manufacturing processes are designed to meet the highest standards of precision and efficiency. This HDI PCB design guide aims to walk you through our advanced capabilities, offering technical insights for engineers, designers, and procurement professionals. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } How to Choose Advanced Material in HDI PCB Design Guide？ In high-density interconnect (HDI) PCB design, material selection plays a critical role in thermal stability, signal integrity, and mechanical reliability. At PCBBUY, we primarily utilize FR-4 base materials with customizable TG (glass transition temperature) ratings, including TG135 to TG170, as well as halogen-free and high CTI (Comparative Tracking Index) substrates upon request. High-TG materials are especially recommended for multi-layered HDI boards subjected to lead-free soldering or operating under high ambient temperatures. For example: Material Type TG Value (°C) CTI Rating Application Example FR-4 (Standard) 135°C ≥175V General-purpose consumer electronics FR-4 (High TG) 170°C ≥300V Automotive control systems Halogen-Free FR4 150-170°C ≥600V Green-compliant medical devices Layer Structure in HDI PCB Design Guide The core of HDI PCB design lies in the construction order and layer stacking. PCBBUY supports 1+N+1 to 2+N+2 constructions, with capabilities extending to 10+ layer advanced HDI for complex system-on-board applications. Typical configurations include: 1+N+1: Basic HDI with a single microvia layer on both outer layers. 2+N+2: Advanced configuration allowing two sequential lamination cycles. Any Layer HDI: All layers can connect with laser vias, enabling maximum design flexibility. Blind vias are implemented with either laser or mechanical drilling: Via Type Min Hole Diameter Method Copper Thickness Laser Blind Via ≥0.075 mm Laser ≥13 μm Mechanical Via ≥0.15 mm Mechanical ≥18 μm (no laser) PCBBUY ensures full via metallization through electroplated copper filling, meeting IPC-6012 Class 2 or 3 standards with via fill depth tolerance of ±15%. Trace Width and Hole Size of HDI PCB Design Guide Signal routing is another key focus in HDI PCB design. PCBBUY supports a minimum trace width and spacing of 2/2 mil, critical for high-speed differential pair designs such as LVDS, USB 3.1, and PCIe. In addition, PCBBUY's advanced laser drilling and image transfer processes allow for: Hole size minimum: 0.075 mm (laser) / 0.15 mm (mechanical) Minimum pad size: 0.15 mm Aspect ratio for vias: Up to 1:1 for blind vias Drill to copper clearance: As low as 100 μm These capabilities help customers meet the increasing demand for miniaturized, high-frequency circuits in mobile, medical, and RF applications. Copper Plating and Via Filling of HDI PCB Design Guide One of the most common reliability risks in HDI PCBs is incomplete via metallization. At PCBBUY, we adopt laser via electroplating with controllable depth (0.05 mm–0.1 mm), ensuring excellent conductivity and mechanical robustness. Key specs include: Laser via copper thickness: ≥13 μm (typical), customized upon request. Via copper fill ratio: ≥95% for critical net vias. Electroplating uniformity: ±10% within the same panel area. Additionally, plugged and capped via processes are offered for solder mask coverage and SMT land finish integrity. DFM Integration in HDI PCB Design Guide PCBBUY provides full-stack Design for Manufacturability (DFM) feedback to ensure customers' HDI designs are fully optimized for volume production. Our DFM services include: Gerber/ODB++ layer analysis for microvia and pad alignment. Impedance modeling with stack-up proposal. Blind/buried via structure validation with lamination sequence. BOM and stencil review for surface assembly readiness. PCBBUY utilizes AOI, flying probe testing, X-ray via inspection, and cross-section analysis to validate critical parameters per IPC-A-600 Class 2/3. HDI Applications Enabled by PCBBUY's Capabilities Our HDI solutions have been successfully deployed across numerous industries: Industry Typical Stack-Up Key Features Wearable Devices 1+6+1 Ultra-thin board, laser vias, 2 mil spacing Automotive Radar 2+8+2 High Tg, impedance control, EMC shielding Industrial IoT Any-Layer (10L) Blind & buried vias, EMI filter integration We also support special requirements like ENIG, OSP, immersion silver, and carbon ink printing for contact switches or keyboard modules. Conclusion: Why Choose PCBBUY for HDI PCB Manufacturing? Our strength lies in our commitment to precision, customization, and scalable HDI production. With a robust QA system and advanced production lines, PCBBUY can meet the demands of the most intricate HDI PCB designs. ✔️ Benefits of choosing PCBBUY: Full support for multi-stage HDI structures Laser via drilling and filling capabilities Customizable materials and stack-ups Tight trace/space resolution with AOI and LDI support Engineering review and one-on-one DFM support Get a Quote Today If you're working on a project that requires advanced HDI PCB manufacturing, we encourage you to contact PCBBUY for a free quote. Our engineers are ready to assist you from design to delivery.

PCB Knowledge ⋅ 06/11/2025 15:14